Heat Dissipation Structure Enhancing Heat Source Self Heat Radiation

ABSTRACT

A heat dissipation structure enhancing heat source self heat radiation includes a heat source and a heat radiation layer formed on at least one side of an exterior of the heat source. With the heat dissipation structure, the heat source can have largely increased self heat radiation efficiency, enabling heat emitted by the heat source to be quickly dissipated into ambient environment to avoid heat accumulation on the heat source.

FIELD OF THE INVENTION

The present invention relates to a heat dissipation structure enhancingheat source self heat radiation, and more particularly to a heatdissipation structure that includes a heat radiation layer formed on anexterior of a heat source to enhance or increase the self heat radiationperformance of the heat source.

BACKGROUND OF THE INVENTION

The currently available mobile electronic devices, such as slim-typenotebook computers, tablet computers, smartphones and so on, all haveconstantly increased operation speed, which leads to largely increasedheat produced by the semiconductor chip of the internal computationexecution unit of the electronic mobile devices. On the other hand, allthe current mobile electronic devices have constantly reduced overallthickness to enable convenient portability thereof. Further, to guardagainst invasion by foreign matters and external moisture, the mobileelectronic devices are usually provided with only a headphone jack andnecessary connector jacks without other openings communicable with anexternal space for air convection. Due to the largely reduced overallthickness of the devices, the heat produced by the computation executionunit and the battery inside the mobile electronic devices just could notbe quickly dissipated into external environment. The closed narrowinternal space of the mobile electronic devices also causes difficultyin the occurrence of air convection, so that heat tends to accumulate orgather inside the mobile electronic devices to seriously affect thedevices' working efficiency or cause a crashed computer due tooverheating. In some worse conditions, the semiconductor chip or thebattery inside the devices is subjected to burnout due to overheating.

Some passive heat dissipation elements, such as heat spreaders, vaporchambers, heat sinks and the like, have been tried for use inside themobile electronic devices to dissipate heat. To use with the currentmobile electronic devices that have largely reduced overall thicknessand highly limited internal space, the above-mentioned heat dissipationelements must also have highly reduced overall thickness. As a result,the wick structures and vapor passages in the thickness-reduced heatspreaders and vapor chambers must also have reduced sizes, which resultsin lowered working efficiency of the heat spreaders and vapor chambersin terms of their general heat transfer capability, preventing thedevices' heat dissipation performance from being effectively upgraded.In brief, the conventional heat spreaders and vapor chambers all fail toeffectively remove or dissipate the heat from the mobile electronicdevices when the latter's internal computation execution units haveexcessively high power. It is therefore the most important target ofmobile electronic device manufacturers to work out an effective way fordissipating heat from a closed narrow space.

SUMMARY OF THE INVENTION

A primary object of the present invention is to provide a heatdissipation structure that includes a heat radiation layer formed on anexterior of a heat source to enhance or increase the self heat radiationperformance of the heat source.

To achieve the above and other objects, the heat dissipation structureenhancing heat source self heat radiation according to the presentinvention includes a heat source and a heat radiation layer formed on atleast one side of an exterior of the heat source. The present inventionis characterized by forming the heat radiation layer on at least oneside of the exterior of the heat source to enhance the self heatradiation performance of the heat source. Since the heat radiation layerformed on one side of the heat source has high heat radiationefficiency, the heat emitted by the heat source located in the closednarrow space of a mobile electronic device can still be effectivelydissipated through natural heat radiation and heat convection, so thatthe heat source can have largely increased heat dissipation performance.

BRIEF DESCRIPTION OF THE DRAWINGS

The structure and the technical means adopted by the present inventionto achieve the above and other objects can be best understood byreferring to the following detailed description of the preferredembodiments and the accompanying drawings, wherein

FIG. 1 is an assembled perspective view of a heat dissipation structureenhancing heat source self heat radiation according to a firstembodiment of the present invention;

FIG. 2 is an assembled sectional view of the heat dissipation structureof FIG. 1; and

FIG. 3 is an assembled sectional view of a heat dissipation structureenhancing heat source self heat radiation according to a secondembodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The present invention will now be described with some preferredembodiments thereof and with reference to the accompanying drawings. Forthe purpose of easy to understand, elements that are the same in thepreferred embodiments are denoted by the same reference numerals.

Please refer to FIGS. 1 and 2 that are assembled perspective andsectional views, respectively, of a heat dissipation structure enhancingheat source self heat radiation according to a first embodiment of thepresent invention. For the purpose of clarity and conciseness, thepresent invention is also briefly referred to as the heat dissipationstructure and generally denoted by reference numeral 1 herein. As shown,the heat dissipation structure 1 in the first embodiment includes a heatsource 11 and a heat radiation layer 12 formed on at least one side ofan exterior of the heat source 11. The heat source 11 can be a battery,a semiconductor element or an integrated circuit (IC) chip. In theillustrated first embodiment, the heat source 11 is described as abattery. However, it is understood the heat source 11 is not limited toa battery but can be any other self-heat-radiation heat sources.Further, the exterior of the heat source 11 can be made of a ceramicmaterial or a metal material.

The heat radiation layer 12 can be of a porous structure, ananostructure, a porous ceramic structure, a porous graphite structure,a high-radiation ceramic structure, or a high-rigidity ceramicstructure. The heat radiation layer 12 being a porous structure can beformed on one side of the heat source 11 by micro arc oxidation (MAO),plasma electrolytic oxidation (PEO), anodic spark deposition (ASD), oranodic oxidation by spark deposition (ANOF). Of course, the heatradiation layer 12 can be otherwise formed on the exterior of the heatsource 11 by way of bonding, printing or coating.

FIG. 3 is an assembled sectional view of a heat dissipation structureenhancing heat source self heat radiation according to a secondembodiment of the present invention. As shown, the second embodiment isstructurally similar to the first embodiment, except that it has a heatradiation layer 12 being a dimpled structure formed by shot peening.

In both of the first and the second embodiment, the heat radiation layer12 is in a black color, a near-black color, or any dark color.

The present invention is highlighted by applying radiation heat transferto heat dissipation. As it is known, both heat conduction and heatconvection require a physical matter as a heat transfer medium toachieve heat energy propagation. However, unlike the heat conduction andheat convection, heat radiation propagates heat energy directly withoutthe need of any heat transfer medium, and is therefore suitable for usein a closed room having very limited heat dissipation space to transferinternally produced heat to an outer casing of, for example, a mobileelectronic device, for heat exchange with ambient air.

Heat radiation means the energy radiated by matters in the form ofelectromagnetic waves. Electromagnetic waves propagate at the speed oflight without the need of a transmission medium. All matterscontinuously emit heat radiation and also absorb heat radiation fromexternal environment. A matter's ability to emit heat has relation tothe matter's surface temperature, color and coarseness. The presentinvention employs the above-mentioned principles to provide the heatradiation layer 123 with good natural heat radiation ability. That is,the heat radiation layer 123 has increased heat dissipation area andenables upgraded heat dissipation efficiency. In addition to thetemperature, the heat radiation intensity of a matter's surface also hasrelation to the matter's surface properties. For example, a matterhaving a black-colored surface tends to absorb and emit heat radiationmore easily. Therefore, the heat radiation layer 123 of the presentinvention is black or black-colored to further enhance its heatradiation efficiency.

The present invention has been described with some preferred embodimentsthereof and it is understood that many changes and modifications in thedescribed embodiments can be carried out without departing from thescope and the spirit of the invention that is intended to be limitedonly by the appended claims.

What is claimed is:
 1. A heat dissipation structure enhancing heatsource self heat radiation, comprising a heat source and a heatradiation layer formed on at least one side of an exterior of the heatsource.
 2. The heat dissipation structure enhancing heat source selfheat radiation as claimed in claim 1, wherein the exterior of the heatsource is made of a material selected from the group consisting of aceramic material and a metal material.
 3. The heat dissipation structureenhancing heat source self heat radiation as claimed in claim 1, whereinthe heat source is selected from the group consisting of a battery, asemiconductor element, and an integrated circuit (IC) chip.
 4. The heatdissipation structure enhancing heat source self heat radiation asclaimed in claim 1, wherein the heat radiation layer is of a structureselected from the group consisting of a porous structure, ananostructure, a porous ceramic structure, and a porous graphitestructure.
 5. The heat dissipation structure enhancing heat source selfheat radiation as claimed in claim 1, wherein the heat radiation layeris of a porous structure formed on one side of the heat source by aprocess selected from the group consisting of micro arc oxidation (MAO),plasma electrolytic oxidation (PEO), anodic spark deposition (ASD), andanodic oxidation by spark deposition (ANOF).
 6. The heat dissipationstructure enhancing heat source self heat radiation as claimed in claim1, wherein the heat radiation layer is of a dimpled structure formed byshot peening.
 7. The heat dissipation structure enhancing heat sourceself heat radiation as claimed in claim 1, wherein the heat radiationlayer has a color selected from the group consisting of a black color, anear-black color, and any dark colors.
 8. The heat dissipation structureenhancing heat source self heat radiation as claimed in claim 1, whereinthe heat radiation layer is of a structure selected from the groupconsisting of a high-radiation ceramic structure and a high-rigidityceramic structure.
 9. The heat dissipation structure enhancing heatsource self heat radiation as claimed in claim 1, wherein the heatradiation layer is formed on the exterior of the heat source in a mannerselected from the group consisting of bonding, printing and coating. 10.The heat dissipation structure enhancing heat source self heat radiationas claimed in claim 2, wherein the heat radiation layer has a colorselected from the group consisting of a black color, a near-black color,and any dark colors.
 11. The heat dissipation structure enhancing heatsource self heat radiation as claimed in claim 3, wherein the heatradiation layer has a color selected from the group consisting of ablack color, a near-black color, and any dark colors.
 12. The heatdissipation structure enhancing heat source self heat radiation asclaimed in claim 4, wherein the heat radiation layer has a colorselected from the group consisting of a black color, a near-black color,and any dark colors.
 13. The heat dissipation structure enhancing heatsource self heat radiation as claimed in claim 5, wherein the heatradiation layer has a color selected from the group consisting of ablack color, a near-black color, and any dark colors.
 14. The heatdissipation structure enhancing heat source self heat radiation asclaimed in claim 6, wherein the heat radiation layer has a colorselected from the group consisting of a black color, a near-black color,and any dark colors.